H5TQ2G63GFR-RDC.pdf

The H5TQ2G83GFR-xxC, H5TQ2G63GFR-xxC,H5TQ2G83GFR-xxI, H5TQ2G63GFR-xxI, H5TQ2G83GFRxxL,H5TQ2G63GFR-xxL,H5TQ2G83GFR-xxJ,H5TQ2G63GFR-xxJ are a 2,147,483,648-bit CMOS Double Data

Rate III (DDR3) Synchronous DRAM, ideally suited for the main memory applications which requires large

memory density and high bandwidth. SK Hynix 2Gb DDR3 SDRAMs offer fully synchronous operations referenced to both rising and falling edges of the clock. While all addresses and control inputs are latched on

the rising edges of the CK (falling edges of the CK), Data, Data strobes and Write data masks inputs are

sampled on both rising and falling edges of it. The data paths are internally pipelined and 8-bit prefetched

to achieve very high bandwidth.

FEATURES

• VDD=VDDQ=1.5V +/- 0.075V

• Fully differential clock inputs (CK, CK) operation

• Differential Data Strobe (DQS, DQS)

• On chip DLL align DQ, DQS and DQS transition with CK

 transition

• DM masks write data-in at the both rising and falling

 edges of the data strobe

• All addresses and control inputs except data,

 data strobes and data masks latched on the

 rising edges of the clock

• Programmable CAS latency 5, 6, 7, 8, 9, 10, 11, 12, 13

and 14 supported

• Programmable additive latency 0, CL-1, and CL-2

 supported

• Programmable CAS Write latency (CWL) = 5, 6, 7, 8

 9 and 10

• Programmable burst length 4/8 with both nibble

 sequential and interleave mode

• BL switch on the fly

• 8banks

• Average Refresh Cycle (Tcase 0 oC~ 95 oC)

- 7.8 µs at 0oC ~ 85 oC

- 3.9 µs at 85oC ~ 95 oC

Commercial Temperature( 0oC ~ 95 oC)

Industrial Temperature( -40oC ~ 95 oC)

• JEDEC standard 78ball FBGA(x8), 96ball FBGA(x16)

• Driver strength selected by EMRS

• Dynamic On Die Termination supported

• Asynchronous RESET pin supported

• ZQ calibration supported

• TDQS (Termination Data Strobe) supported (x8 only)

• Write Levelization supported

• 8 bit pre-fetch