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S25FS128SDSNFI100
Phone Buy
Collect
Datasheet
Description
Features • Density - S25FS128S - 128 Mbits (16 MB) - S25FS256S - 256 Mbits (32 MB) • Serial peripheral interface (SPI) - SPI clock polarity and phase modes 0 and 3 - Double data rate (DDR) option - Extended addressing: 24- or 32-bit address options - Serial command subset and footprint compatible with S25FL-A, S25FL-K, S25FL-P, and S25FL-S SPI families - Multi I/O command subset and footprint compatible with S25FL-P, and S25FL-S SPI families • Read - Commands: Normal, Fast, Dual I/O, Quad I/O, DDR Quad I/O - Modes: Burst Wrap, Continuous (XIP), QPI - Serial flash discoverable parameters (SFDP) and common flash interface (CFI), for configuration information • Program - 256- or 512-byte page programming buffer - Program suspend and resume - Automatic ECC – internal hardware error correction code generation with single-bit error correction • Erase - Hybrid sector options • Physical set of eight 4-KB sectors and one 32-KB sector at the top or bottom of address space with all remaining sectors of 64 KB or • Physical set of eight 4-KB sectors and one 224-KB sector at the top or bottom of address space with all remaining sectors of 256 KB - Uniform sector options • Uniform 64-KB or 256-KB blocks for software compatibility with higher density and future devices - Erase suspend and resume - Erase status evaluation - 100,000 program-erase cycles, minimum - 20 year data retention, minimum • Security features - One-time program (OTP) array of 1024 bytes - Block protection: • Status Register bits to control protection against program or erase of a contiguous range of sectors • Hardware and software control options - Advanced sector protection (ASP) • Individual sector protection controlled by boot code or password • Option for password control of read access • Technology - 65-nm MIRRORBIT™ technology with Eclipse architecture • Supply voltage - 1.7 V to 2.0 V • Temperature range / grade - Industrial (–40°C to +85°C) - Industrial Plus (–40°C to +105°C) - Automotive AEC-Q100 grade 3 (–40°C to +85°C) - Automotive AEC-Q100 grade 2 (–40°C to +105°C) - Automotive AEC-Q100 grade 1 (–40°C to +125°C) • Packages (All Pb-free) - 8-lead SOIC 208 mil (SOC008) — FS128S only - WSON 6 5 mm (WND008) — FS128S only - WSON 6 8 mm (WNH008) - 16-lead SOIC 300 mil (SO3016 — FS256S only) - BGA-24 6 8 mm • 5 5 ball (FAB024) footprint • 4 6 ball (FAC024) footprint - Known good die, and known tested die All the evaluation(0)
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