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FS820R08A6P2B

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Price
$555.88
Cumulative sales0Cumulative evaluation0
Date Code
  1. 22+
  2. 21+
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Quantity
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8619147700036
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Datasheet
DESCRIPTION
Description
The HybridPACKTM Drive is a very compact
six-pack module (750V/820A) optimized for hybrid
and electric vehicles. The power module
implements the new EDT2 IGBT generation, which
is an automotive Micro-Pattern Trench-Field-Stop
cell design optimized for electric drive train
applications. The chipset has benchmark current
density combined with short circuit ruggedness and
increased blocking voltage for reliable inverter
operation under harsh environmental conditions.
The EDT2 IGBTs also show excellent light load
power losses, which helps to improve system
efficiency over a real driving cycle. The EDT2 IGBT
was optimized for applications with switching
frequencies in the range of 10 kHz.
The new HybridPACKTM Drive power module family
comes with mechanical guiding elements
supporting easy assembly processes for customers.
Furthermore, the press-fit pins for the signal
terminals avoid additional time consuming selective
solder processes, which provides cost savings on
system level and increases system reliability. The
direct cooled baseplate with PinFin structure in the
FS820R08A6P2B product best utilizes the
implemented chipset and shows superior thermal
characteristics. Due to the high clearance &
creepage distances, the module family is also well
suited for increased system working voltages and
supports modular inverter approaches.
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SHENZHEN JDW ELECTRONIC 

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Phone:+86  18818703853

Fax:+86 0755 82563503

Email:sale1@hkjdw-chip.cn
Adress:25F, Building C, Electronic Technology Building, No. 2070 Shennan Middle Road, Futian District, Shenzhen,China

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