The TMS320F2809, TMS320F2809-Q1, TMS320F2808, TMS320F2808-Q1 TMS320F2806, TMS320F2802, TMS320F2801-Q1, TMS320F28015-Q1, TMS320F28016-Q1, TMS320C2802-Q1, and TMS320C2801 devices, members of the TMS320C28x DSP generation, are highly integrated, high-performance solutions for demanding control applications.

Throughout this document, TMS320F2809, TMS320F2809-Q1 TMS320F2808, TMS320F2808-Q1 TMS320F2806, TMS320F2802-Q1, TMS320F2801-Q1, TMS320C2802, TMS320C2801, TMS320F28015-Q1, and TMS320F28016-Q1 are abbreviated as F2809, F2808, F2806, F2802-Q1, F2801-Q1, C2802, C2801, F28015-Q1, and F28016-Q1, respectively. TMS320F28015-Q1 and TMS320F28016-Q1 are abbreviated as F2801x. Device Comparison (100-MHz Devices) and Device Comparison (60-MHz Devices) provide a summary of features for each device.

• High-performance static CMOS technology

• 100 MHz (10-ns cycle time)

• 60 MHz (16.67-ns cycle time)

• Low-power (1.8-V core, 3.3-V I/O) design

• JTAG boundary scan support

• IEEE Standard 1149.1-1990 Standard Test Access Port and Boundary Scan Architecture

• High-performance 32-bit CPU (TMS320C28x)

• 16 × 16 and 32 × 32 MAC operations

• 16 × 16 dual MAC

• Harvard bus architecture

• Atomic operations

• Fast interrupt response and processing

• Unified memory programming model

• Code-efficient (in C/C++ and Assembly)

• On-chip memory

• F2809: 128K × 16 flash, 18K × 16 SARAM F2808: 64K × 16 flash, 18K × 16 SARAM F2806: 32K × 16 flash, 10K × 16 SARAM F2802: 32K × 16 flash, 6K × 16 SARAM F2801: 16K × 16 flash, 6K × 16 SARAM F2801x: 16K × 16 flash, 6K × 16 SARAM

• 1K × 16 OTP ROM (flash devices only)

• C2802: 32K × 16 ROM, 6K × 16 SARAM C2801: 16K × 16 ROM, 6K × 16 SARAM

• Boot ROM (4K × 16)

• With software boot modes (via SCI, SPI, CAN, I2C, and parallel I/O)

• Standard math tables

• Clock and system control

• On-chip oscillator

• Watchdog timer module

• Any GPIO A pin can be connected to one of the three external core interrupts

• Peripheral Interrupt Expansion (PIE) block that supports all 43 peripheral interrupts

• Endianness: Little endian

• 128-bit security key/lock

• Protects flash/OTP/L0/L1 blocks

• Prevents firmware reverse-engineering

• Three 32-bit CPU timers 

• Enhanced control peripherals

• Up to 16 PWM outputs

• Up to 6 HRPWM outputs with 150-ps MEP resolution

• Up to four capture inputs

• Up to two quadrature encoder interfaces

• Up to six 32-bit/six 16-bit timers

• Serial port peripherals

• Up to 4 SPI modules

• Up to 2 SCI (UART) modules

• Up to 2 CAN modules

• One Inter-Integrated-Circuit (I2C) bus

• 12-bit ADC, 16 channels

• 2 × 8 channel input multiplexer

• Two sample-and-hold

• Single/simultaneous conversions

• Fast conversion rate: 80 ns - 12.5 MSPS (F2809 only) 160 ns - 6.25 MSPS (280x) 267 ns - 3.75 MSPS (F2801x)

• Internal or external reference

• Up to 35 individually programmable, multiplexed GPIO pins with input filtering

• Advanced emulation features

• Analysis and breakpoint functions

• Real-time debug via hardware

• Development support includes

• ANSI C/C++ compiler/assembler/linker

• Code Composer Studio™ IDE

• SYS/BIOS

• Digital motor control and digital power software libraries

• Low-power modes and power savings

• IDLE, STANDBY, HALT modes supported

• Disable individual peripheral clocks

• Package options

• Thin quad flatpack (PZ)

• MicroStar BGA™ (GGM, ZGM)

• Temperature options

• A: –40°C to 85°C (PZ, GGM, ZGM)

• S: –40°C to 125°C (PZ, GGM, ZGM)

• Q: –40°C to 125°C (PZ) (AEC-Q100 qualification for automotive applications)